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Polymatech在泰米尔纳德邦的工厂生产印度制造的半导体芯片

该公司在泰米尔纳德邦坎奇普拉姆的主要制造工厂每天生产40万枚芯片,这些芯片已经投放到市场。该公司表示,在未来几个月内,Polymatech的目标是达到每天生产100万枚芯片(每年3亿枚)的产能。


该公司曾在7月份宣布,将投资超过10亿美元扩大半导体芯片制造。
该公司曾在7月份宣布,将投资超过10亿美元扩大半导体芯片制造。

新德里:Polymatech,印度第一家半导体芯片制造商日本技术该公司已开始生产其光半导体和存储模块。目前,该公司在泰米尔纳德邦坎奇普拉姆的主要制造工厂每天生产40万枚芯片,这些芯片已经投放到市场。Polymatech在一份媒体新闻稿中表示,在未来几个月内,该公司的目标是达到每天生产100万枚芯片(每年3亿枚)的全产能。

该公司在7月份宣布将投资超过10亿美元进行扩张半导体芯片制造业。光半导体用于照明、医疗和食品卫生应用。Polymatech已经完全封装了光半导体高温共烧陶瓷基板(HTCC)和自带芯片(玉米)。它们完全由Polymatech公司构思、设计和开发,是封闭的工具。

cob封装用于高功率照明应用,用于体育场照明、港口照明、机场照明等,而封装在HTCC基板中的光半导体用于飞机、地铁列车、采矿站和交通灯等。制造中的UVa芯片用于医疗和食品卫生应用。该新闻稿称,Polymatech正在生产的内存模块是所有主要电子系统不可或缺的一部分。

Polymatech创始人总裁Eswara Rao Nandam表示:“我们很高兴宣布我们的光半导体和存储模块的全面投产。我们的照片提供超过97%的CRI (显色指数).到2029年,全球半导体产业的市场规模预计将达到13400亿美元印度市场将成为该行业的重要组成部分,预计到2026年将增长640亿美元。再加上持续的全球芯片短缺,造就了巨大的增长潜力。我们Polymatech的目标是充分利用这一全球机遇,到2025年成为亚洲最大的芯片制造商之一。”

除了光半导体和存储模块,Polymatech公司还在进行半导体芯片生产试验的最后阶段,这些半导体芯片将用于医疗和一般用途。面积达15万平方公里。泰米尔纳德邦的半导体生产设施将在这方面发挥重要作用。这个最先进的设施,其中温度和rh控制的洁净室已经准备好,并配备了从日本进口的机器,采用了全面的工业4.0主题。该新闻稿还补充说,该公司还致力于当前产品的向前和向后集成,以及已生产产品的本地化。

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The company had announced in July that it would be investing over USD 1 billion to expand semiconductor chips manufacturing. <\/span><\/figcaption><\/figure>
New Delhi: Polymatech, India\u2019s first semiconductor chip manufacturer powered by Japanese technology<\/a>, has kick started production of its Opto-semiconductors and memory modules. At present, the company\u2019s main manufacturing plant in Kancheepuram, Tamil Nadu, manufactures 400,000 chips every day and these have already been released into the market. Within the next few months, Polymatech aims to attain its full capacity of manufacturing 1 million chips daily (300 million a year), the company said in a media release.

The company had announced in July that it would be investing over USD 1 billion to expand
semiconductor chips<\/a> manufacturing. Opto-semiconductors are used in lighting, medical and food sanitization applications. Polymatech has completely packaged Opto-Semiconductors in both High Temperature Co-fired Ceramic substrates<\/a> (HTCC) and Chip on Board<\/a> (COB). They are wholly conceived, designed and developed by Polymatech and these are closed tools, the release said.

COBs are packed for high power lighting applications used for stadium lighting, port lighting, airport lighting, etc. while Opto-semiconductors packed in HTCC substrates are used in aircraft, metro trains, mining stations and traffic lights etc. UVa chips that are in manufacturing are used in medical and food sanitization applications. Memory modules that are in manufacturing at Polymatech are integral part of all major electronic systems, the release said.